METAPOR® is a high-performance, air-permeable composite material widely used in vacuum clamping applications, particularly in semiconductor manufacturing. Engineered from microporous aluminum or ceramics, METAPOR eliminates the need for drilled vacuum holes while providing uniform suction, high stability, and contamination-free clamping. These properties make it an ideal choice for handling delicate silicon wafers and other sensitive substrates.

Traditional ceramic disk vacuum chucks have been used due to their high precision and rigidity. However, METAPOR line of materials has emerged as a superior alternative to the basic ceramic disc, and offers both a unique microporous aluminum option (BF100 AL) and a superior ceramic based option (CE100), all of which provide enhanced performance at a fraction of the cost. METAPOR can also be used for SMD applications and wire bonding processes.